Shenzhen MOCO Interconnect Co., Ltd. (hereinafter “MOCO”) participated in the 26th China International Optoelectronic Exposition (CIOE 2025), held from September 10–12, 2025 at the Shenzhen World Exhibition & Convention Center. At CIOE, MOCO presented a broad range of high-performance connectors and tailored interconnect solutions designed for demanding optoelectronic, sensing and precision-instrumentation applications.
CIOE — a leading trade platform covering the full optoelectronics industry chain including information communication, precision optics, camera technology, lasers and smart manufacturing, infrared/ultraviolet, intelligent sensing, new displays, AR/VR and photonics innovation — provided an ideal stage for MOCO to engage technology partners, system integrators and OEMs seeking rugged, high-density and high-speed connector solutions.
Building on the momentum from Shenzhen, MOCO will also make a major appearance at the China International Industry Fair (CIIF 2025) in Shanghai from September 23–27, 2025. The company will be located at Booth C059 (Hall 6.1) in the National Exhibition and Convention Center (NECC), where it will showcase the latest innovations in high-end industrial connectors and interconnect solutions targeted at industrial control, defense, aerospace, energy, telecommunications and medical markets.
At CIIF, MOCO plans to present not only its core high-reliability push-pull and multi-pole circular connectors but also customized assemblies and services addressing ruggedization, EMC shielding, IP-rated sealing and high-cycle durability. The company expects to use the exhibition to expand partnerships and accelerate adoption of its connector platforms across multiple sectors.
MOCO warmly invites global partners, industry professionals, and customers to visit Booth C059 (Hall 6.1) at CIIF 2025 in Shanghai. Join us to explore our latest innovations and discuss how MOCO’s customized interconnect solutions can support your business success.